Item | Description |
Chip Type | IMPINJ / ALIEN / NXP etc. |
Frequency | UHF 860-960MHz |
Work Mode | Passive |
Dimension | Smaller than 300x400mm (customizable) |
Box Materials | 350g white cardboard (customizable) |
Production Process | Printing + Flip chip bonding + Die cutting |
Printing | Accept simple printing on the surface of box |
Die Cutting | Finish product or 300x400mm layout without cutting |
Cautions | Materials must bear 150°C Cannot print secondly after chip bonding Paper product must be kept under seal, not in a wet environment |